<?xml version="1.0" encoding="ISO-8859-1"?> <rss version="2.0">
<channel>
<title><![CDATA[TDK Corporation - Americas | Press Release]]></title>
<link><![CDATA[http://www.tdk.com/pressrelease.php]]></link>
<language>en</language>
<description><![CDATA[The latest press releases from TDK]]></description>
<copyright>Copyright(c) 1996-2009 TDK Corporation. All rights reserved.</copyright>
<lastBuildDate>Saturday 13th March 2010 11:02:27 PM</lastBuildDate>
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<title><![CDATA[Inductors: SMD pulse transformers for LAN applications (TDK-EPC Corporation)]]></title>
<link><![CDATA[http://bit.ly/a11wnG]]></link>
<pubDate>2010-03-11 10:46:50</pubDate>
</item>
<item>
<title><![CDATA[Acoustic components: World's smallest MEMS microphones with a digital interface (TDK-EPC)]]></title>
<link><![CDATA[http://www.epcos.com/100304]]></link>
<pubDate>2010-03-04 16:24:36</pubDate>
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<title><![CDATA[Multilayer ceramic capacitors: Further miniaturized series of C0G MLCCs (TDK-EPC Corporation)]]></title>
<link><![CDATA[http://www.tdk.co.jp/teaah01/aah31100.htm]]></link>
<pubDate>2010-02-25 10:06:46</pubDate>
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<title><![CDATA[PTC thermistors: SMD series with AEC Q-200 qualification (TDK-EPC Corporation)]]></title>
<link><![CDATA[http://www.epcos.com/100128]]></link>
<pubDate>2010-01-28 19:05:38</pubDate>
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<title><![CDATA[Combined Components: Sample Kit for Combined ESD and RFI Protection (TDK-EPC Corporation)]]></title>
<link><![CDATA[http://www.epcos.com/091217]]></link>
<pubDate>2009-12-17 09:52:04</pubDate>
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<title><![CDATA[SAW components: Sample kit with SAW filters for advanced metering applications (TDK-EPC Corporation)]]></title>
<link><![CDATA[http://www.epcos.com/091203]]></link>
<pubDate>2009-12-03 09:44:22</pubDate>
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<title><![CDATA[Sample Kit with Varistors for Transient Voltage Suppression up to 385 Volts (TDK-EPC Corporation)]]></title>
<link><![CDATA[http://www.epcos.com/web/generator/Web/Sections/Press/TradePress/PressReleases2009/CeramicComponents/Sample__kit__varistors__Page,locale=en.html]]></link>
<pubDate>2009-11-19 12:49:27</pubDate>
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<item>
<title><![CDATA[TDK Develops Compact, High-Capacitance MLCC for 100V Applications]]></title>
<link><![CDATA[http://tdk.com/pdf/pr_tdk_develops_compact_mlcc.pdf]]></link>
<pubDate>2009-06-18 09:40:50</pubDate>
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<item>
<title><![CDATA[Tdk Develops Soft Termination Multilayer Ceramic Capacitors]]></title>
<link><![CDATA[http://tdk.com/pdf/pr_tdk_soft_termination_mlcc_capacitors.pdf]]></link>
<pubDate>2009-05-29 11:20:48</pubDate>
</item>
<item>
<title><![CDATA[TDK Develops Three New Gigaspira Multilayer Beads]]></title>
<link><![CDATA[http://tdk.com/pdf/pr_gigaspira_multilayer_beads.pdf]]></link>
<pubDate>2009-04-20 11:24:27</pubDate>
</item>
<item>
<title><![CDATA[TDK Develops BGA Chip Varistor with EMI Filter Function]]></title>
<link><![CDATA[http://tdk.com/pdf/pr_bga_varistor.pdf]]></link>
<pubDate>2009-03-23 10:25:53</pubDate>
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<item>
<title><![CDATA[TDK Corporation Awarded Delphi's 2009 Pinnacle Award]]></title>
<link><![CDATA[http://tdk.com/pdf/pr_pinnacle_delphi_phi_award.pdf]]></link>
<pubDate>2009-03-20 08:35:23</pubDate>
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<title><![CDATA[TDK Develops New Magnetic Sheets with Ultra-High Magnetic Permeability]]></title>
<link><![CDATA[http://tdk.com/pdf/pr_tdk_magnetic_sheets.pdf]]></link>
<pubDate>2009-03-19 11:33:38</pubDate>
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<title><![CDATA[TDK Corporation Receives Skyworks' 2008 Supplier of the Year Award]]></title>
<link><![CDATA[http://tdk.com/pdf/pr_skyworks_awards.pdf]]></link>
<pubDate>2009-02-24 11:26:39</pubDate>
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<title><![CDATA[TDK Develops Electric Double Layer &quot;Supercapacitor&quot;]]></title>
<link><![CDATA[http://tdk.com/pdf/pr_new_tdk_supercapacitor.pdf]]></link>
<pubDate>2009-02-18 09:20:59</pubDate>
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<title><![CDATA[TDK Features Industry's First* MLCC with Settable ESR at APEC 2009]]></title>
<link><![CDATA[http://tdk.com/pdf/pr_esr_cap.pdf]]></link>
<pubDate>2009-02-16 01:59:32</pubDate>
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<title><![CDATA[TDK to Present NTC MLCC Technology at APEC 2009]]></title>
<link><![CDATA[http://tdk.com/pdf/pr_ntc_cap.pdf]]></link>
<pubDate>2009-02-16 01:59:31</pubDate>
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<title><![CDATA[Multilayer Ceramic Chip Capacitor New Product Listing (Availability 2009 Q1)]]></title>
<link><![CDATA[http://tdk.com/pdf/NewMLCCProducts.pdf]]></link>
<pubDate>2009-02-10 11:17:45</pubDate>
</item>
</channel>
</rss>